The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 1992
Filed:
Apr. 26, 1990
Takashi Nakao, Tokyo, JP;
Yoshiaki Emoto, Higashiyamato, JP;
Koichiro Sekiguchi, Tokyo, JP;
Masayuki Iketani, Kasugai, JP;
Kunizo Sahara, Hamura, JP;
Ikuo Yoshida, Musashimurayama, JP;
Akiomi Kohno, Tomobe, JP;
Masaya Horino, Chiyoda, JP;
Hideaki Kamohara, Katsuta, JP;
Shouichi Irie, Yokohama, JP;
Hiroshi Akasaki, Akishima, JP;
Kanji Otsuka, Higashiyamato, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi VLSI Engineering Corp., Tokyo, JP;
Abstract
An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.