Aichi, Japan

Shoji Aoki

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shoji Aoki. Retrieved from https://idiyas.com/inventor/shoji-aoki-bclkgcd0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal1 out of 834,513 
Other
 patents

Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Innovations of Shoji Aoki in Electrostatic Wafer Clamping Technology

Introduction

Shoji Aoki is a notable inventor based in Aichi, Japan. He has made significant contributions to the field of electrostatic wafer clamping technology. His innovative approach has led to the development of a unique platen that enhances the clamping force of wafers, regardless of environmental conditions.

Latest Patents

Aoki holds a patent for a "Platen for electrostatic wafer clamping apparatus." This invention features a platen body made of dielectric material, with grains of electrically conductive material diffused within it. The design allows for a relatively large electrostatic capacitance, resulting in an increased clamping force that remains effective even in varying humidity levels. The patent also describes how the thickness of the platen body can be reduced while maintaining a constant clamping force with lower applied voltage. This innovation eliminates any residual voltage on the platen and accelerates the wafer release process. The conductive grains are present in a volume ranging from about 2.5 percent to about 15.0 percent, with preferred materials including carbonated transition metals and nitrified transition metals. The dielectric material is ideally Al2O3, while the conductive grains are preferably TiC, constituting about 5% of the platen's volume.

Career Highlights

Throughout his career, Aoki has demonstrated a commitment to advancing technology in the semiconductor industry. His work has not only improved the efficiency of wafer clamping but has also contributed to the overall performance of semiconductor manufacturing processes.

Collaborations

Aoki has collaborated with notable colleagues such as Hiroaki Yanagida and Hideaki Matsubara. Their combined expertise has fostered innovation and development in their respective fields.

Conclusion

Shoji Aoki's contributions to electrostatic wafer clamping technology exemplify the impact of innovative thinking in the semiconductor industry. His patented inventions continue to influence advancements in manufacturing processes, showcasing the importance of research and development in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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