Shizhen Liao

Title: Shizhen Liao: Innovator in PCB Heat Dissipation Technology

Introduction

Shizhen Liao is a prominent inventor based in Beijing, China. She has made significant contributions to the field of technology, particularly in the area of heat dissipation for printed circuit boards (PCBs). Her innovative work has led to the development of a patented assembly that enhances the performance of servers.

Latest Patents

Shizhen Liao holds a patent for a PCB heat dissipation assembly and a server having the same. This invention includes a PCB board with multiple chips arranged on it. The assembly features at least one heat sink positioned on the chips, which contains a heat dissipation air duct. Additionally, an air baffle is strategically placed adjacent to the heat sink, extending along the air duct to optimize heat management.

Career Highlights

Liao is currently employed at Bitmain Technologies Limited, a leading company in the technology sector. Her role involves advancing innovative solutions that address critical challenges in server performance and efficiency. With her expertise, she has contributed to the company's reputation for cutting-edge technology.

Collaborations

Shizhen Liao has worked alongside notable colleagues, including Xuesong Zhou and Jianjun Pan. Their collaborative efforts have fostered an environment of innovation and creativity within their projects.

Conclusion

Shizhen Liao's contributions to PCB heat dissipation technology exemplify her commitment to innovation. Her patent and work at Bitmain Technologies Limited highlight her role as a key player in advancing technological solutions.