The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Oct. 31, 2019
Bitmain Technologies Inc., Beijing, CN;
Xuesong Zhou, Beijing, CN;
Jianjun Pan, Beijing, CN;
Shizhen Liao, Beijing, CN;
Shuhao Zhang, Beijing, CN;
Xudong Wang, Beijing, CN;
BITMAIN TECHNOLOGIES INC., Beijing, CN;
Abstract
Disclosed are a PCB heat dissipation assembly () and a server having same. The PCB heat dissipation assembly () includes: a PCB board (), a plurality of chips () being arranged on the PCB board (); at least one heat sink (), the heat sink () being arranged on the plurality of chips (), and the heat sink () including a heat dissipation air duct (); and an air baffle (), the air baffle () being arranged adjacent to the at least one heat sink (), the air baffle () being located on one side of the at least one heat sink (), and the air baffle () extending along the heat dissipation air duct ().