Shanghai, China

Shiwei Jiang

This inventor holds 2 USPTO granted patents and 2 EPO patents. Top assignee: Shanghai Bangbang Robotics Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shiwei Jiang. Retrieved from https://idiyas.com/inventor/shiwei-jiang-o6ieel25

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Shiwei Jiang: Innovator in Omni Wheel Technology

Introduction

Shiwei Jiang is a prominent inventor based in Shanghai, China. He is known for his innovative contributions to the field of robotics and mobility solutions. His work focuses on enhancing the functionality and stability of moving devices.

Latest Patents

Shiwei Jiang holds a patent for an omni wheel and moving device. This invention includes a hub bracket and roller components, where each roller component consists of a first and a second roller assembly. The design ensures that the second rollers do not shake or oscillate during operation, thereby reducing vibrations and noise. This improvement significantly enhances the running stability of the omni wheel.

Career Highlights

Jiang is associated with Shanghai Bangbang Robotics Co., Ltd., where he applies his expertise in robotics to develop advanced mobility solutions. His innovative designs have the potential to revolutionize the way robotic systems navigate various environments.

Collaborations

Shiwei Jiang has collaborated with notable colleagues, including Jianguo Li and Jie Liu. Their combined efforts contribute to the advancement of technology in the robotics sector.

Conclusion

Shiwei Jiang's contributions to omni wheel technology exemplify his commitment to innovation in robotics. His work not only enhances device stability but also paves the way for future advancements in mobility solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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