Shiori Beppu

Title: Shiori Beppu: Innovator in Adhesive Technologies

Introduction

Shiori Beppu is a notable inventor based in Warabi, Japan. She has made significant contributions to the field of adhesive technologies, holding a total of 4 patents. Her work focuses on developing innovative materials that enhance the performance and reliability of adhesive products.

Latest Patents

One of Shiori Beppu's latest patents is a release sheet and pressure-sensitive adhesive article. This release sheet comprises a base material with a release agent layer that contains substantially no silicone compound. The polymer material used includes a polyolefine-based thermoplastic elastomer with a density ranging from 0.80 to 0.90 g/cm. The Young's modulus of the release agent layer is between 0.1 to 0.3 GPa, which helps to suppress adverse effects on electric components and prevents blocking when the release film is stored in a rolled form. Additionally, she has developed an adhesive containing a ladder-type polysilsesquioxane, which firmly bonds metals and synthetic resins. This adhesive is utilized in an adhesive sheet that features an adhesive layer formed on at least one side of a substrate.

Career Highlights

Shiori Beppu is currently employed at Lintec Corporation, where she continues to innovate in the field of adhesive technologies. Her work has been instrumental in advancing the capabilities of adhesive products, making them more effective and reliable for various applications.

Collaborations

Shiori collaborates with talented individuals such as Toshio Sugizaki and Atsuko Kameshima, who contribute to her innovative projects and research efforts.

Conclusion

Shiori Beppu's contributions to adhesive technologies through her patents and work at Lintec Corporation highlight her role as a leading inventor in this field. Her innovative approaches continue to shape the future of adhesive materials and applications.