Company Filing History:
1 out of 832,843 Years Active: 2002
Title: Shinya Takyu: Innovator in Semiconductor Wafer Technology
Introduction: Shinya Takyu, an inventive mind hailing from Sugito-machi, Japan, has made significant contributions to the field of semiconductor technology. With a focus on enhancing manufacturing processes, Takyu holds one patent that showcases his expertise in developing methods for wafer back grinding.
Latest Patents: Takyu's notable patent is titled "Method for grinding a wafer back," which introduces a surface protective sheet specifically designed for semiconductor wafers. This innovation is utilized during the wafer back grinding process and involves two main steps: firstly, the formation of grooves on the surface of a semiconductor wafer that is equipped with a circuit, ensuring the grooves' cutting depth remains less than the wafer's thickness; secondly, the grinding of the wafer's back to reduce its thickness, ultimately leading to the division of the wafer into individual chips. The protective sheet is composed of a substrate layered with a pressure-sensitive adhesive that possesses an elastic modulus of at least 1.0×10 Pa at 40°C. This development plays a crucial role in the efficient production of extremely thin integrated circuit (IC) chips with high yields.
Career Highlights: While specific details regarding Takyu's career journey are not disclosed, his singular patent indicates a dedicated involvement in semiconductor technology. His work reflects a deep understanding of the intricate processes involved in wafer production and IC chip development.
Collaborations: In his professional endeavors, Shinya Takyu collaborates with esteemed colleagues, including Kazuhiro Takahashi and Kazuyoshi Ebe. Together, they contribute to advancements in the semiconductor field, fostering innovation and improving manufacturing techniques.
Conclusion: Shinya Takyu represents a significant figure in the realm of semiconductor innovations. His patented method for wafer back grinding illustrates the ongoing advancements in technology aimed at enhancing the efficiency of IC chip production. As the demand for thinner and more efficient chips continues to grow, Takyu's contributions will undoubtedly play a pivotal role in shaping the future of semiconductor manufacturing.