The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2002
Filed:
Aug. 18, 1999
Other;
Abstract
A surface protective sheet for semiconductor wafer, used in wafer back grinding during a process comprising (1) forming grooves on the surface a of semiconductor wafer furnished with a circuit so that the cutting depth of the grooves are smaller than the thickness of the wafer and (2) grinding the back of the wafer so that the thickness of the wafer is reduced and that the wafer is finally divided into individual chips. The above surface protective sheet is comprised of a substrate and, superimposed thereon, a pressure sensitive adhesive layer having an elastic modulus of at least 1.0×10 Pa at 40° C. This surface protective sheet is applicable to a process which enables producing extremely thin IC chips with high yield.