Tokyo, Japan

Shinya Oosaki


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Innovations by Shinya Oosaki in Photosensitive Resin Technology

Introduction

Shinya Oosaki is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of photosensitive resin compositions, particularly in applications related to printed wiring boards. With a total of two patents to his name, Oosaki's work has advanced the technology used in electronic manufacturing.

Latest Patents

Oosaki's latest patents focus on a photosensitive resin composition that can be utilized in both projection exposure and direct-write exposure machines without the need for fine adjustments. This innovation allows for the formation of resist patterns with excellent cross-sectional shapes, minimizing issues such as undercuts and omissions in the resist pattern. The composition includes an acid-modified vinyl group-containing epoxy resin, a photopolymerization initiator, a benzophenone compound as a sensitizer, and a photopolymerizable compound. These advancements ensure that the line widths in the resist pattern maintain favorable linearity, enhancing insulation reliability and crack resistance.

Career Highlights

Throughout his career, Oosaki has worked with prominent companies such as Hitachi Chemical Company, Ltd. and Resonac Corporation. His experience in these organizations has contributed to his expertise in developing innovative materials for electronic applications.

Collaborations

Oosaki has collaborated with notable coworkers, including Nobuhito Komuro and Yuta Daijima. Their combined efforts have furthered the research and development of advanced materials in the field.

Conclusion

Shinya Oosaki's contributions to the field of photosensitive resin technology have paved the way for advancements in printed wiring board manufacturing. His innovative patents reflect a commitment to improving the reliability and efficiency of electronic components.

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