This inventor holds 2 USPTO granted patents and 1 published patent application, plus 1 CIPO patent and 1 EPO patent. Top assignee: Denso Corporation. Active years: 2010-2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010-2019
Title: Shinsuke Nagasaka - Innovator in Solder Paste Technology
Introduction
Shinsuke Nagasaka is an inventor based in Osaka-shi, Japan. He is known for his innovative work in the field of solder paste technology. Although he currently holds no granted patents, his contributions to the industry are noteworthy.
Latest Patent Applications
Nagasaka's latest patent application is titled "FLUX FOR SOLDER PASTE, AND SOLDER PASTE." This application describes a flux for solder paste that includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate with a C-Calkyl group and another (meth)acrylate. The application specifies that the weight ratio of the acrylic resin should be between 0.5 and 1.2 when the weight of the rosins is taken as 1. Additionally, the flux is designed to be fluidized by applying a shear force ranging from 10 Pa to 150 Pa.
Conclusion
Shinsuke Nagasaka's work in solder paste technology demonstrates his commitment to innovation in the field. His latest patent application reflects his expertise and potential contributions to the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile