Osaka, Japan

Shinsa Hamada

This inventor holds 2 USPTO granted patents. Top assignee: Konishi Co., Ltd.. Active years: 2006-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinsa Hamada. Retrieved from https://idiyas.com/inventor/shinsa-hamada

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2006-2011

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2 patents (USPTO):Explore Patents

Title: Innovations of Shinsa Hamada in Adhesive Technology

Introduction

Shinsa Hamada is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of adhesive technology, particularly with his innovative self-curable water-based solid adhesives. With a total of 2 patents, his work emphasizes safety, environmental considerations, and high performance.

Latest Patents

Hamada's latest patents include the "Self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive" and "Self-reactive/curable water-based solid adhesive and method of bonding with the self-reactive/curable water-based solid adhesive." These adhesives consist of several components, including an anionic-group-containing polymer, a basic compound, water, and a gelling agent. They are designed to provide excellent adhesion to various materials such as plastics, metals, and glass. Furthermore, they exhibit remarkable heat and water resistance after curing, making them highly effective for various applications.

Career Highlights

Shinsa Hamada is currently employed at Konishi Co., Ltd., where he continues to develop innovative adhesive solutions. His work is characterized by a commitment to creating products that are not only effective but also safe for humans and the environment.

Collaborations

Hamada collaborates with talented individuals such as Kuniharu Harada and Syunsuke Shibahara, contributing to a dynamic and innovative work environment.

Conclusion

Shinsa Hamada's contributions to adhesive technology through his patents reflect his dedication to innovation and safety. His work continues to influence the industry positively, showcasing the potential of environmentally friendly adhesive solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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