Okazaki, Japan

Shinji Ota


Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 133(Granted Patents)


Location History:

  • Aichi, JP (1994)
  • Nukata-gun, JP (1998)
  • Okazaki, JP (2001 - 2002)

Company Filing History:


Years Active: 1994-2002

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Shinji Ota

Introduction

Shinji Ota is a notable inventor based in Okazaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the efficiency and reliability of electronic components.

Latest Patents

One of his latest patents is a mounting structure of a semiconductor element. In this invention, a flip chip IC is mounted on an alumina laminated substrate through conductive lands and bumps. A resin fills the space between the flip chip IC and the substrate, while inspection lands are provided for inspecting the flip chip IC. These lands are electrically connected to the conductive lands, allowing for effective inspection and preventing resin separation from the substrate. Another significant patent is for a multilayer circuit board that prevents local warp on its mounting surface. This circuit board consists of laminated substrates, with high pattern density portions strategically placed to ensure stability during manufacturing.

Career Highlights

Shinji Ota has worked with prominent companies in the industry, including Nippondenso Co., Ltd. and Denso Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and circuit board design.

Collaborations

Throughout his career, Ota has collaborated with talented individuals such as Takashi Nagasaka and Yasutomi Asai. These partnerships have fostered innovation and advancement in their respective fields.

Conclusion

Shinji Ota's contributions to semiconductor technology and circuit board design highlight his role as a leading inventor. His patents reflect a commitment to enhancing electronic component reliability and efficiency.

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