Shinji Ogi

Title: Shinji Ogi and His Printed Circuit Board Bonding Film Patent.

Introduction

Shinji Ogi is an inventor associated with Yuki, Japan, and Hitachi Chemical Company, Ltd. His patent work includes an invention aimed at improving the flexibility, strength, and handling of bonding films used in printed circuit boards.

Latest Patents

Ogi is credited with 1 patent: “Bonding Film for Printed Circuit Boards.” The invention describes a bonding film designed to resist cracking when bent around a small radius while retaining sufficient mechanical strength in its semi-cured state. It also aims to avoid excessive brittleness and debris during cutting, while combining flexibility with flame retardancy.

The disclosed composition may include high-polymer epoxy resin, denatured polyamide produced by reacting epoxy resin with polyamide, polyfunctional epoxy resin, and a curing agent. Preferred embodiments use denatured polyamide containing a polyalkylene-glycol or polycarbonate-diol residue. The high-polymer epoxy resin may be produced by polymerizing bifunctional epoxy resin with bifunctional phenol resin and may have a weight-average molecular weight of at least 50,000.

Career Highlights

Ogi’s listed patent is associated with Hitachi Chemical Company, Ltd. It addresses practical manufacturing and handling challenges in printed circuit board materials, including bending durability, semi-cured strength, clean cutting, and flame retardancy.

Collaborations

Akinari Kida and Hiroaki Hirakura are identified as Ogi’s coworkers. Their names are provided as professional associations, though the available information does not specify their roles in the patent.

Conclusion

Shinji Ogi’s patent presents a bonding-film formulation intended to balance flexibility, mechanical strength, clean processing, and flame retardancy for printed circuit board applications.