Company Filing History:
Years Active: 2008-2010
Title: The Innovations of Shinichi Akiyama
Introduction
Shinichi Akiyama is a notable inventor based in Akiruno, Japan. He has made significant contributions to the field of wire bonding methods, holding a total of 3 patents. His work has been instrumental in advancing semiconductor technology.
Latest Patents
Akiyama's latest patents include a wire bonding method that connects a first bonding point and a second bonding point by a wire. This method involves several steps, including press-bonding a ball formed on the tip end of a wire to a first bonding point, thus forming a press-bonded ball. The process also includes slightly raising a capillary, moving it toward a second bonding point, and then lowering the capillary by a smaller amount than it was raised. Finally, the capillary is raised to allow the wire to be paid out and moved toward the second bonding point, effectively connecting the wire to the second bonding point.
Another significant patent is related to a semiconductor device, which utilizes the same wire bonding method described above. This innovation showcases Akiyama's expertise in enhancing the efficiency and reliability of semiconductor connections.
Career Highlights
Shinichi Akiyama is currently employed at Kabushiki Kaisha Shinkawa, where he continues to develop innovative solutions in the field of semiconductor technology. His work has garnered attention for its practical applications and contributions to the industry.
Collaborations
Akiyama collaborates with his coworker, Tatsunari Mii, to further enhance their research and development efforts. Their teamwork has led to advancements in wire bonding techniques and semiconductor devices.
Conclusion
Shinichi Akiyama's contributions to wire bonding methods and semiconductor technology highlight his role as an influential inventor. His patents reflect a commitment to innovation and excellence in the field.