Osaka, Japan

Shingo Okada

This inventor holds 1 USPTO granted patent. Top assignee: Yanmar Power Technology Co., Inc.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shingo Okada. Retrieved from https://idiyas.com/inventor/shingo-okada-i6uau7co

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Shingo Okada: Innovator in Heat Pump Technology

Introduction

Shingo Okada is a prominent inventor based in Osaka, Japan. He is known for his innovative contributions to heat pump technology. With a focus on efficiency and performance, Okada has made significant strides in the field of thermal energy management.

Latest Patents

Okada holds 1 patent for a heat pump design. This innovative heat pump features a first outdoor heat exchanger and a second outdoor heat exchanger that are mutually connected in parallel. The design includes a merge part where refrigerant from both outdoor heat exchangers converges, along with a third outdoor heat exchanger connected to this merge part. This configuration enhances the overall efficiency of the heat pump system.

Career Highlights

Shingo Okada is currently employed at Yanmar Power Technology Co., Inc. His work at Yanmar has allowed him to explore and develop advanced technologies in the energy sector. His dedication to innovation has positioned him as a key figure in the company.

Collaborations

Okada has collaborated with notable colleagues, including Norihiro Okuda and Sachie Tsujikawa. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Shingo Okada's contributions to heat pump technology exemplify his commitment to innovation and efficiency. His work continues to influence the energy sector, making a lasting impact on thermal management solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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