Chikuma, Japan

Shin-ichi Yamaguchi


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: **Inventor Shin-ichi Yamaguchi: Innovating Silicon Oxide Film Formation**

Introduction

Shin-ichi Yamaguchi, a notable inventor based in Chikuma, Japan, has made significant contributions to the field of semiconductor technology. With a focus on enhancing the fabrication process of silicon oxide films, his innovative methods aim to improve the efficiency and yield of devices produced from Silicon-On-Insulator (SOI) wafers.

Latest Patents

Yamaguchi holds a patent for a method for forming a silicon oxide film on an SOI wafer. This method includes performing thermal oxidation treatment on an SOI wafer that has an oxide film on its backside, followed by an additional heat treatment in a non-oxidizing atmosphere at a higher temperature. This two-step process effectively prevents warping of the SOI wafer, which can occur due to a thick oxide film. As a result, this innovation diminishes exposure and adsorption failures associated with warpage and significantly enhances device fabrication yields.

Career Highlights

Shin-ichi Yamaguchi is associated with Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His expertise and innovative work have positioned him as a key player in advancing SOI wafer technology. With a well-documented patent, Yamaguchi contributes to the ongoing evolution of semiconductor manufacturing processes.

Collaborations

Yamaguchi has collaborated with esteemed colleagues, including Isao Yokokawa and Nobuhiko Noto. Their combined efforts have focused on the challenges inherent in semiconductor manufacturing, particularly in maintaining the integrity and effectiveness of SOI wafers during device fabrications.

Conclusion

Shin-ichi Yamaguchi's innovative approach to forming silicon oxide films represents a significant advancement in semiconductor technology. His patent illustrates a method that not only mitigates issues related to SOI wafer warping but also boosts production reliability and device yield. As technology continues to evolve, contributions like those of Yamaguchi will undoubtedly play a crucial role in shaping the future of semiconductor devices.

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