Shin-ichi Obata

Title: Innovations of Shin-ichi Obata

Introduction

Shin-ichi Obata is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foils.

Latest Patents

Obata holds a patent for an "Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil." This invention focuses on controlling peel strength at an organic release interface between a carrier foil and a copper-microparticle layer, which constitutes an electrodeposited copper foil with carrier. The patent outlines a method where a barrier copper layer is formed on the release interface layer, and copper microparticles are created on the barrier layer. Additionally, it describes an anti-corrosion treatment using a plating bath containing either a single metallic component or multiple components for forming an alloy, with a deposition potential less negative than -900 mV (vs. AgCl/Ag reference electrode).

Career Highlights

Shin-ichi Obata is associated with Mitsui Mining & Smelting Company, Ltd., where he has been instrumental in advancing the company's technological capabilities. His work has led to innovations that enhance the performance and reliability of copper materials used in various applications.

Collaborations

Obata collaborates with fellow inventor Makoto Dobashi, contributing to the development of innovative solutions in their field.

Conclusion

Shin-ichi Obata's contributions to the field of materials science, particularly through his patented innovations, highlight his role as a key figure in advancing technology in copper foil manufacturing. His work continues to influence the industry positively.