Mitsui Minings & Melting Co., Ltd.

Shin-ichi Obata

Makoto Dobashi

To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface layer and copper microparticles are formed on the barrier layer; (2) the anti-corrosion treatment is carried out by use of a plating bath containing a single metallic component or a plurality of metallic components for forming an alloy, the plating bath(s) having a deposition potential less negative than &minus;900 mV (vs. AgCl/Ag reference electrode); and (3) methods (1) and (2) are combined.

Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil

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Ageo, Japan

Shin-ichi Obata