Shin Fukuda

Title: Shin Fukuda: Innovator in Copper Foil Technology

Introduction

Shin Fukuda is a notable inventor based in Imaichi, Japan, recognized for his contributions to the field of printed wiring boards. With a total of 3 patents, Fukuda has made significant advancements in copper foil technology, particularly for high-density applications.

Latest Patents

Fukuda's latest patents focus on the development of ultra-thin copper foils designed for high-density ultra-fine printed wiring boards. His inventions include a copper foil that features a carrier with a release layer, a diffusion preventive layer, and a copper electroplating layer, all laminated in a specific order. The surface of the copper electroplating layer is intentionally roughened to enhance performance. Additionally, he has developed a copper-clad laminated board that incorporates this ultra-thin copper foil, which is then used to create printed wiring boards and multi-layered printed wiring boards.

Career Highlights

Throughout his career, Fukuda has worked with Circuit Foil Japan Co., Ltd., where he has honed his expertise in copper foil technology. His innovative work has positioned him as a key figure in the industry, contributing to advancements that are critical for modern electronics.

Collaborations

Fukuda has collaborated with notable professionals in his field, including Akitoshi Suzuki and Kazuhiro Hoshino. These partnerships have further enriched his work and expanded the impact of his inventions.

Conclusion

Shin Fukuda's contributions to copper foil technology have made a significant impact on the electronics industry. His innovative patents and collaborations highlight his role as a leading inventor in this specialized field.