The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Jul. 13, 2005
Akitoshi Suzuki, Imaichi, JP;
Shin Fukuda, Imaichi, JP;
Kazuhiro Hoshino, Imaichi, JP;
Tadao Nakaoka, Imaichi, JP;
Akitoshi Suzuki, Imaichi, JP;
Shin Fukuda, Imaichi, JP;
Kazuhiro Hoshino, Imaichi, JP;
Tadao Nakaoka, Imaichi, JP;
Circuit Foil Japan Co., Ltd., Tokyo, JP;
Abstract
The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.