Shin Chi

Title: Innovations of Shin Chi in Chip Package Structures

Introduction

Shin Chi is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods for chip package structures. His work is essential in enhancing the efficiency and performance of electronic devices.

Latest Patents

Shin Chi holds a patent for a "Method for forming chip package structure with heat conductive layer." This patent describes a method that includes disposing a chip over a substrate and forming a heat-spreading wall structure adjacent to the chip. The process involves creating a first gap between the chip and the heat-spreading wall structure, followed by the formation of a first heat conductive layer in that gap. Additionally, a second heat conductive layer is formed over the chip, and a heat-spreading lid is disposed over the substrate to cover all components. This innovative approach is crucial for improving heat dissipation in semiconductor devices.

Career Highlights

Shin Chi is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this prestigious company allows him to collaborate with some of the brightest minds in the field, contributing to advancements in technology.

Collaborations

Some of his notable coworkers include Chien-Hao Hsu and Kuo-Chin Chang. Their collaborative efforts in research and development have further propelled innovations in semiconductor packaging.

Conclusion

Shin Chi's contributions to the field of chip package structures exemplify the importance of innovation in technology. His patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role in advancing semiconductor technology.