Taipei, Taiwan

Shih-Wei Pan

This inventor holds 2 USPTO granted patents. Top assignee: Dexin Corporation. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih-Wei Pan. Retrieved from https://idiyas.com/inventor/shih-wei-pan-jcgpwwh3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Shih-Wei Pan: Innovator in Flexible Charging Technology

Introduction

Shih-Wei Pan is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of flexible charging technology, holding 2 patents that showcase his innovative approach to manufacturing methods.

Latest Patents

His latest patents include a manufacturing method of a flexible charging pad. This method involves providing a double-sided tape to form an adhesion layer, attaching isolation papers on both sides, and then removing one to attach a conductor. A first pad layer is placed over the conductor, and an adhesive is used to cover the entire assembly, forming a molded layer. Another patent focuses on the flexible charging pad itself and the same manufacturing method, emphasizing the efficiency and practicality of his designs.

Career Highlights

Shih-Wei Pan is currently associated with Dexin Corporation, where he continues to develop innovative solutions in the realm of flexible charging technology. His work has been instrumental in advancing the capabilities of charging devices, making them more versatile and user-friendly.

Collaborations

He collaborates with Ho-Lung Lu, a talented woman in the field, contributing to the innovative projects at Dexin Corporation.

Conclusion

Shih-Wei Pan's contributions to flexible charging technology reflect his dedication to innovation and excellence. His patents not only highlight his inventive spirit but also pave the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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