Shih Wei Liang

Title: Shih Wei Liang: Innovator in Semiconductor Device Packaging

Introduction

Shih Wei Liang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor device packaging, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

Liang's latest patents focus on semiconductor device packages that include conductors electrically connecting stacked semiconductor devices. One of his patents describes a configuration where a first semiconductor device is placed over a substrate, with a second semiconductor device positioned above it. The active surface of the second semiconductor device faces away from the substrate, allowing conductors to extend from bond pads of the second semiconductor device along the surfaces of both semiconductor devices and the substrate. This design ensures that the conductors are in contact with the bond pads and routing members, with a dielectric material interposed for insulation. An encapsulant distinct from the dielectric material covers the entire assembly, enhancing the reliability and performance of the semiconductor device packages.

Another patent by Liang elaborates on techniques for forming semiconductor device packages and related products. Similar to his previous work, this patent emphasizes the importance of electrical interconnections that extend from bond pads of the second semiconductor device to routing members on the substrate. The inclusion of a dielectric material and encapsulant ensures the integrity of the device, while methods of fabrication are also disclosed.

Career Highlights

Shih Wei Liang is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to push the boundaries of semiconductor technology and contribute to advancements in device packaging.

Collaborations

Liang has collaborated with notable coworkers, including Po Chih Yang and Yu Jen Chen, who is a talented woman in the field. Their teamwork has fostered an environment of innovation and creativity, leading to the development of cutting-edge semiconductor solutions.

Conclusion

Shih Wei Liang's contributions to semiconductor device packaging exemplify his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of the complexities involved in semiconductor design and fabrication. Through his work at Micron Technology Incorporated, Liang continues to influence the future of the semiconductor industry.