Shih-Long Wei

Title: Innovations by Shih-Long Wei in Electronic Component Packaging

Introduction

Shih-Long Wei is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic component packaging. His innovative approach has led to the development of a unique encapsulation method that enhances the protection of electronic components.

Latest Patents

Shih-Long Wei holds a patent for a "Packaging device of electronic components and an encapsulation method thereof." This patent describes an encapsulation method that involves preparing electronic components with cylindrical bodies. The cylindrical body features front and rear ends made of metals and a middle end made of ceramics. The encapsulation process includes preparing a mould, encasing the cylindrical bodies, and injecting heated protective materials to coat the components. This method ensures that the electronic components are well-protected during their use.

Career Highlights

Shih-Long Wei is associated with Walsin Technology Corporation, where he applies his expertise in electronic component packaging. His work has been instrumental in advancing the technology used in the industry. With a focus on innovation, he continues to contribute to the development of new methods and devices.

Collaborations

Shih-Long Wei collaborates with talented individuals such as Kao-Yuan Wang and Nai-Chuan Chuang. Their combined efforts in research and development have led to advancements in electronic component technology.

Conclusion

Shih-Long Wei's contributions to the field of electronic component packaging demonstrate his innovative spirit and dedication to improving technology. His patent and collaborative efforts highlight the importance of teamwork in driving advancements in the industry.