This inventor holds 2 USPTO granted patents. Top assignees: Scenario Lab Co., Ltd., Yuan Ze University. Active years: 2015-2020.
Company Filing History:
Years Active: 2015-2020
Title: Shih-Ju Wang: Innovator in Solder Joint Technology
Introduction
Shih-Ju Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of solder joint technology, holding a total of 2 patents. His work focuses on enhancing the reliability and performance of solder joints in electronic applications.
Latest Patents
One of his latest patents is a drafting template for a solder joint with a multilayer intermetallic compound structure. This innovative solder joint includes a copper pad and a tin-based solder, with multiple intermetallic compound (IMC) layers strategically placed to improve performance. The first IMC layer is a CuSn layer, while the second and third IMC layers are (CuNiPd)Sn layers, each with specific compositional ranges to optimize the solder joint's properties.
Career Highlights
Shih-Ju Wang has worked with various organizations, including Scenario Lab Co., Ltd. and Yuan Ze University. His experience in these institutions has allowed him to develop and refine his innovative solder joint technologies.
Collaborations
He has collaborated with notable colleagues, including Der-Jang Yu and Wen-Chi Lin, who have contributed to his research and development efforts.
Conclusion
Shih-Ju Wang's contributions to solder joint technology demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of materials science and engineering, paving the way for advancements in electronic manufacturing.