Yuan Ze University

Scenario Lab Co., Ltd.

Shih-Ju Wang

Cheng-En Ho

Der-Jang Yu

Wen-Chi Lin

Yu-Hui Wu

Drafting template

A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a CuSn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (CuNiPd)Snlayer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (CuNiPd)Snlayer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2&#x3e;x1.

Growing community of inventors

Taipei, Taiwan

Shih-Ju Wang