Shih-Jie Lin

Title: Shih-Jie Lin: Innovator in Wafer Polishing Technology

Introduction

Shih-Jie Lin is a notable inventor based in Fujian, China. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of wafer polishing technology. His innovative approach has led to the development of a unique cleaning process that enhances the efficiency of wafer polishing pads.

Latest Patents

Shih-Jie Lin holds a patent for a cleaning process of wafer polishing pads and cleaning nozzles. This process involves providing a wafer polishing pad and performing a planarization process, which leaves a residue on the pad. The cleaning step utilizes a cleaning nozzle that features a Y-shaped pipe, allowing for the effective removal of residue through a combination of cleaning liquid and pressurized gas.

Career Highlights

Lin is currently employed at United Semiconductor (Xiamen) Co., Ltd., where he continues to advance his research and development efforts. His work has been instrumental in improving the cleaning processes used in semiconductor manufacturing, thereby contributing to the overall efficiency and effectiveness of the industry.

Collaborations

Shih-Jie Lin collaborates with several talented individuals in his field, including Ching-Wen Teng and Kuo Liang Huang. These partnerships foster innovation and enhance the development of new technologies in wafer polishing.

Conclusion

Shih-Jie Lin's contributions to wafer polishing technology exemplify the importance of innovation in the semiconductor industry. His patented cleaning process not only improves efficiency but also sets a standard for future advancements in the field.