Shih-Hsing Chan

Title: Shih-Hsing Chan: Innovator in Wafer-Level Chip Packaging

Introduction: Shih-Hsing Chan, an accomplished inventor based in Zhoulan Township, Taiwan, has made significant contributions to the field of semiconductor packaging. With a focus on innovative methods in the design and fabrication of wafer-level chip packages, Chan has demonstrated a commitment to advancing technology.

Latest Patents: Shih-Hsing Chan holds a patent titled "Method of Fabricating Wafer-Level Chip Package." This patent outlines a novel technique for creating a wafer-level chip package, starting with a wafer that contains two adjacent chips. The method involves exposing conducting pads on the chips through a specially designed recess and isolation layer, forming a conductive layer and a redistribution layer, and ultimately applying a solder layer. This innovative process enhances the efficiency and effectiveness of chip packaging.

Career Highlights: Chan is currently associated with Xintec Corporation, where he focuses on the development of advanced packaging solutions. His work has not only contributed to the company's reputation as a leader in semiconductor technology but has also positioned him as a notable figure in the field of invention.

Collaborations: During his career, Shih-Hsing Chan has collaborated with talented professionals such as Chuan-Jin Shiu and Tsang-Yu Liu, fostering a creative environment that encourages innovation and problem-solving in semiconductor design.

Conclusion: Shih-Hsing Chan's contributions to the technology of wafer-level chip packages exemplify the spirit of innovation. His dedication to improving semiconductor packaging processes through inventive methods continues to impact the industry positively. With his unique insights and collaborative efforts, Chan stands as an inspiring figure for aspiring inventors and engineers.