Shih-Cheng Lin

Title: Shih-Cheng Lin: Innovator in Multilayer PCB Technology

Introduction

Shih-Cheng Lin is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of multilayer printed circuit board (PCB) structures. His innovative work has led to advancements that enhance the performance and efficiency of electronic devices.

Latest Patents

Shih-Cheng Lin holds a patent for a multilayer PCB structure with an inner thermally conductive material. The patent, titled "Multilayer PCB structure with inner thermally conductive material, optical communication module having the same and method of fabricating the same," describes a multilayer PCB that includes a core layer, a first layer on one surface of the core layer, and a second layer on the opposite surface. This design incorporates a thermally conductive material within the core layer, which improves thermal management in electronic applications. The innovative structure also features a window formed on the second layer, exposing part of the core layer beneath the thermally conductive material.

Career Highlights

Shih-Cheng Lin is currently employed at Prime World International Holdings Ltd. His work at the company focuses on advancing PCB technology and developing solutions for optical communication modules. His expertise in this area has positioned him as a key player in the electronics industry.

Collaborations

Shih-Cheng Lin collaborates with talented individuals such as Che-Shou Yeh and Ling-An Kung. Their combined efforts contribute to the innovative projects at Prime World International Holdings Ltd., fostering a collaborative environment that drives technological advancements.

Conclusion

Shih-Cheng Lin's contributions to multilayer PCB technology exemplify his commitment to innovation in the electronics field. His patent and collaborative efforts highlight the importance of teamwork in achieving groundbreaking advancements.