The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Aug. 25, 2021
Applicant:
Prime World International Holdings Ltd., New Taipei, TW;
Inventors:
Che-Shou Yeh, New Taipei, TW;
Ling-An Kung, New Taipei, TW;
Cheng-Ta Tsai, New Taipei, TW;
Shih-Cheng Lin, New Taipei, TW;
Assignee:
Prime World International Holdings Ltd., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/181 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); H05K 2201/10121 (2013.01);
Abstract
A multilayer PCB structure includes a core layer, a first layer on a first surface of the core layer, a second layer on a second surface of the core layer, and a thermally conductive material in the core layer. The first surface and the second surface of the core layer are opposite to each other, and a window is formed on the second layer by removing part of the second layer. The window of the second layer exposes part of the core layer below the thermally conductive material.