Yokohama, Japan

Shigetoshi Hirastuka


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1986

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1 patent (USPTO):Explore Patents

Title: Shigetoshi Hiratsuka: Pioneer of Thermal Head Technology

Introduction

Shigetoshi Hiratsuka, an inventive mind based in Yokohama, Japan, has made a significant contribution to technology through his innovative patent. His work primarily focuses on advancements in thermal head technology, which plays a crucial role in various applications, including printers and other thermal systems.

Latest Patents

Hiratsuka holds a unique patent for a thermal head that features a sophisticated structure. This thermal head includes an electrically insulating substrate, a glaze layer, a heating resistor layer, and a series of conductors designed to enhance performance and reliability. The clever design of the interlayer insulating film, comprised of both inorganic and organic materials, addresses common issues related to crack formation and circuit discontinuation, ensuring durability and functionality.

Career Highlights

Throughout his career, Shigetoshi Hiratsuka has been associated with Hitachi, Ltd., where he has continued to innovate and push the boundaries of thermal technology. His commitment to excellence is evident in his singular patent, which highlights his expertise and dedication to the field of electronics.

Collaborations

Hiratsuka has worked alongside talented colleagues, including Moriaki Fuyama and Katsumi Tamura. These collaborations have likely contributed to the development and refinement of his patent, demonstrating the power of teamwork in the innovation process.

Conclusion

In conclusion, Shigetoshi Hiratsuka stands out as a notable inventor within the realm of thermal head technology. His patent showcases not only his inventive capabilities but also his commitment to overcoming existing challenges in the field. As technology continues to evolve, Hiratsuka's contributions will undoubtedly influence future innovations in thermal systems.

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