Company Filing History:
Years Active: 2014-2018
Title: Shigeru Yamada: Innovator in Printed Wiring Board Technology
Introduction
Shigeru Yamada is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of four patents. His innovative designs have advanced the capabilities of electronic components and their interconnections.
Latest Patents
Yamada's latest patents include a "Printed Wiring Board for Package-on-Package" and a "Multilayer Wiring Board Having Wiring Structure for Mounting Multiple Electronic Components and Method for Manufacturing the Same." The first patent describes a printed wiring board that features a first insulating layer, a wiring layer with a conductor pattern, and electrodes that connect to an IC chip. The second patent outlines a multilayer wiring board that allows for the mounting of multiple electronic components, enhancing the efficiency and functionality of electronic devices.
Career Highlights
Shigeru Yamada is currently employed at Ibiden Company Limited, where he continues to innovate in the field of electronics. His work has been instrumental in developing advanced wiring solutions that meet the growing demands of modern technology.
Collaborations
Yamada has collaborated with notable coworkers such as Yoshinori Shizuno and Takashi Kariya, contributing to a dynamic team focused on pushing the boundaries of electronic design.
Conclusion
Shigeru Yamada's contributions to printed wiring board technology exemplify his commitment to innovation in electronics. His patents reflect a deep understanding of the complexities involved in modern electronic systems.