Gunma, Japan

Shigeru Wada

This inventor holds 1 USPTO granted patent. Top assignee: Toshiba Silicone Co., Ltd.. Active years: 1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shigeru Wada. Retrieved from https://idiyas.com/inventor/shigeru-wada-2v9z36ap

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Shigeru Wada: Innovator in Silicone Rubber Production

Introduction

Shigeru Wada is a notable inventor based in Gunma, Japan. He has made significant contributions to the field of silicone rubber production. His innovative work has led to the development of a unique process that enhances the efficiency of manufacturing heat-vulcanizable silicone rubber.

Latest Patents

Wada holds a patent for a "Process for continuously producing heat-vulcanizable silicone rubber." This patent outlines a method that includes specific steps for the continuous production of a heat-vulcanizable silicone rubber compound. His invention is crucial for improving production processes in the silicone industry.

Career Highlights

Wada is associated with Toshiba Silicone Co., Ltd., where he applies his expertise in silicone technology. His work at Toshiba has positioned him as a key player in the advancement of silicone rubber manufacturing techniques.

Collaborations

Throughout his career, Wada has collaborated with talented individuals such as Hironori Amano and Junichiro Watanabe. These collaborations have further enriched his contributions to the field.

Conclusion

Shigeru Wada's innovative approach to silicone rubber production exemplifies the impact of dedicated inventors in advancing industrial processes. His patent and work at Toshiba Silicone Co., Ltd. highlight his importance in the field of materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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