Tokyo, Japan

Shigeru Koyano

This inventor holds 2 USPTO granted patents. Top assignee: Polymatech Co., Ltd.. Active years: 2008-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shigeru Koyano. Retrieved from https://idiyas.com/inventor/shigeru-koyano-cvy10zb8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 58(Granted Patents)


Company Filing History:


Years Active: 2008-2009

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2 patents (USPTO):Explore Patents

Title: Shigeru Koyano: Innovator in Heat Diffusion Technology

Introduction

Shigeru Koyano is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of heat diffusion technology, particularly in electronic apparatuses. With a total of 2 patents, Koyano's work focuses on enhancing the efficiency and performance of electronic devices.

Latest Patents

Koyano's latest patents revolve around the innovative design of a key sheet that efficiently diffuses local heat generated by devices mounted on a board. The first patent describes a key sheet with a base sheet made of a rubber-like elastic material mixed with a heat conductive filler. This design allows for the suppression of local heat storage generated by semiconductor devices, eliminating the need for additional heat diffusion members. The result is a thinner and lighter electronic apparatus that meets the demands for effective heat management.

The second patent further develops this concept by incorporating a heat diffusion sheet within the key sheet. This sheet includes a graphite layer and a resin film, and in some cases, a thin metal plate. By integrating the heat diffusion capabilities into the base sheet itself, Koyano's design ensures that local heat generated by semiconductor devices can be effectively managed without requiring separate components. This innovation not only addresses heat diffusion but also contributes to the reduction of thickness and weight in electronic devices.

Career Highlights

Koyano's career is marked by his dedication to advancing technology in the electronics sector. His innovative approaches have led to practical solutions that enhance the performance and reliability of electronic devices. His work is recognized for its potential to significantly impact the industry.

Collaborations

Koyano has collaborated with talented individuals such as Yutaka Nakanishi and Motoki Ozawa. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Shigeru Koyano's contributions to heat diffusion technology exemplify his commitment to innovation in the electronics field. His patents reflect a deep understanding of the challenges faced by modern electronic devices and offer practical solutions that enhance their performance. Koyano's work continues to influence the industry, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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