This inventor holds 2 USPTO granted patents. Top assignee: Yamaha Corporation. Active years: 1999-2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Shizuoka, JP (1999)
- Hamamatsu, JP (2002)
Company Filing History:
Years Active: 1999-2002
Title: Shigeru Kinpara: Innovator in Heat-Curable Resin Technology
Introduction
Shigeru Kinpara is a notable inventor based in Hamamatsu, Japan. He has made significant contributions to the field of heat-curable resin technology, holding 2 patents that showcase his innovative approach to manufacturing processes.
Latest Patents
One of his latest patents is a "Method for manufacturing heat-curable resin molded product." This invention addresses the issue of concavities in molded products that arise from the curing shrinkage of heat-curable resins, such as unsaturated polyester resin. By incorporating a central core member made of ABS resin within the mold, Kinpara's method synchronizes the expansion of the core member with the curing shrinkage of the resin, effectively preventing defects in the final product.
Another significant patent is the "Method of finishing board with thick resin film for making under layer." In this process, thick molded strips of unsaturated polyester resin are bonded to the edges of a panel member. The edges are then cut to ensure they are coplanar with the panel surfaces, followed by a coating of unsaturated polyester resin. This method not only improves the appearance of the board member but also ensures that the butt edges remain invisible after polishing.
Career Highlights
Shigeru Kinpara is currently employed at Yamaha Corporation, where he continues to innovate and develop new technologies in the field of resin manufacturing. His work has had a lasting impact on the industry, particularly in enhancing the quality and durability of molded products.
Collaborations
Throughout his career, Kinpara has collaborated with talented individuals such as Hisayoshi Ohsumi and Yoshinori Sagisaka. These collaborations have further enriched his work and contributed to the advancement of resin technology.
Conclusion
Shigeru Kinpara's contributions to heat-curable resin technology exemplify his innovative spirit and dedication to improving manufacturing processes. His patents reflect a deep understanding of material properties and a commitment to quality, making him a significant figure in his field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile