Tokyo, Japan

Shigeru Amemiya


Average Co-Inventor Count = 1.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014-2023

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3 patents (USPTO):Explore Patents

Title: Shigeru Amemiya: Innovator in Wire Bonding Technology

Introduction

Shigeru Amemiya is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of wire bonding technology, holding three patents that enhance the quality and efficiency of wire joining processes. His work is instrumental in advancing manufacturing techniques in the electronics industry.

Latest Patents

One of Amemiya's latest patents is a wire bonding apparatus. This invention includes an ultrasonic horn designed to input two ultrasonic vibrations, which excite a capillary mounted at the front end with different frequencies in both the Y-direction and the X-direction. The control unit adjusts the magnitudes of these vibrations to optimize the amplitude ratio of the capillary in both directions. This innovation effectively suppresses degradation in the quality of the joining between wires and leads.

Another significant patent is a wire shape inspecting apparatus and method. This apparatus features a camera that captures images of a wire from above, along with a light source that illuminates the wire. The control unit performs an inspection image acquiring process, capturing multiple images while varying the focal distance. It also includes a shape detecting process that identifies light emitting portions in the images, determining their actual positions based on the captured data.

Career Highlights

Shigeru Amemiya is currently employed at Shinkawa Ltd., a company known for its advanced manufacturing solutions. His work at Shinkawa has allowed him to apply his innovative ideas in practical settings, contributing to the company's reputation in the industry.

Collaborations

Amemiya collaborates with Nobuyuki Aoyagi, a fellow innovator in the field. Their partnership enhances the development of new technologies and solutions in wire bonding and inspection processes.

Conclusion

Shigeru Amemiya's contributions to wire bonding technology through his patents and work at Shinkawa Ltd. highlight his role as a key innovator in the electronics manufacturing sector. His inventions continue to influence the industry, ensuring higher quality and efficiency in wire joining processes.

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