Chiba, Japan

Shigenori Ishii


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 74(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Shigenori Ishii: Innovator in Polyester Packaging Materials

Introduction

Shigenori Ishii is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of packaging materials, particularly through his innovative work on polyester compositions. His expertise has led to advancements that enhance the functionality and performance of packaging solutions.

Latest Patents

Ishii holds 1 patent for a polyester packaging material. This invention features a layer formed from a polyester composition that includes 70-95 parts by weight of a polyethylene terephthalate copolymer and 5-30 parts by weight of an ethylene copolymer ionomer. The copolymer is derived from terephthalic acid, ethylene glycol, and cyclohexanedimethanol, with specific molar ratios that optimize its properties. The resulting polyester packaging material exhibits excellent odor-keeping properties, ductility, heat resistance, impact resistance, and heat-sealing capabilities, making it suitable for various applications, including inner materials for paper containers and coatings for cans.

Career Highlights

Shigenori Ishii is associated with Du Pont-Mitsui Polychemicals Co., Ltd., where he has been instrumental in developing innovative packaging solutions. His work has not only contributed to the company's portfolio but has also set new standards in the industry for packaging materials.

Collaborations

Ishii has collaborated with notable colleagues, including Yoshikazu Kutsuwa and Toru Fukada. These partnerships have fostered a creative environment that encourages innovation and the development of advanced materials.

Conclusion

Shigenori Ishii's contributions to polyester packaging materials highlight his role as a key innovator in the field. His patented work demonstrates the potential for improved packaging solutions that meet the demands of modern applications.

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