Ota-ku, Japan

Shigehiko Aoki


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2010

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations in Wafer Grinding: The Contributions of Shigehiko Aoki

Introduction

Shigehiko Aoki, based in Ota-ku, Japan, is a notable inventor recognized for his innovative work in the semiconductor industry. With a focus on enhancing the grinding methods for wafers, Aoki's contributions are pivotal in improving the overall efficiency and effectiveness of wafer production processes.

Latest Patents

Aoki holds a unique patent titled "Grinding Method for Wafer." This invention details a method for grinding the back side of a wafer that has multiple devices on its front side. The process uses a grinding wheel designed to suppress the motion of heavy metal within the wafer through a gettering effect. It also ensures that the die strength of each device remains at approximately 1,000 MPa or more. The grinding wheel features a frame and an abrasive member at its free end, with the abrasive member composed of diamond abrasive grains not exceeding 1 μm in size, secured with a vitrified bond. This method successfully achieves an average surface roughness of the back side of the wafer of less than or equal to 0.003 μm, while limiting the strain layer thickness to 0.05 μm.

Career Highlights

Shigehiko Aoki's journey in the field has been marked by his significant contributions to Disco Corporation, where he applies his expertise in wafer technology. His innovative mindset has not only led to the development of efficient grinding techniques but has also enhanced overall productivity in semiconductor manufacturing.

Collaborations

Throughout his career, Aoki has had the pleasure of collaborating with esteemed colleagues such as Keiichi Kajiyama and Takatoshi Masuda. These partnerships have fostered an environment of innovation and development, driving forward the advancements in wafer processing techniques.

Conclusion

Shigehiko Aoki stands out as an influential figure in the world of semiconductor fabrication. His patented grinding method for wafers demonstrates a commitment to improving production techniques and showcases the potential to enhance device resilience and effectiveness. As the industry continues to evolve, Aoki's contributions remain invaluable, highlighting the significance of innovative methods in technology development.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…