Tokyo, Japan

Shigeharu Takahagi


Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 26(Granted Patents)


Location History:

  • Ibaraki, JP (1997 - 2001)
  • Tokyo, JP (2005 - 2007)

Company Filing History:


Years Active: 1997-2007

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4 patents (USPTO):Explore Patents

Title: Shigeharu Takahagi: Innovator in Wiring Board Technology

Introduction

Shigeharu Takahagi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wiring board technology, holding a total of 4 patents. His innovative designs have advanced the capabilities of semiconductor connections, enhancing the performance of electronic devices.

Latest Patents

One of Takahagi's latest patents is a wiring board and process for producing the same. This invention features a microstrip structure that includes a first conductor layer with conductor wirings connected to a semiconductor chip's external terminal (bonding pad). Additionally, it has a second conductor layer with a conductor pattern linked through a via to a ground wiring, supplying ground potential to the semiconductor chip. The third conductor layer is equipped with a power supply terminal connected through a via to a power supply wiring, providing operational power to the semiconductor chip. It also includes a signal terminal for transmitting electric signals and a ground terminal connected to the conductor pattern in the second conductor layer.

Career Highlights

Shigeharu Takahagi is currently employed at Hitachi Cable, Inc., where he continues to innovate in the field of wiring technology. His work has been instrumental in developing advanced wiring solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Takahagi has collaborated with notable colleagues, including Hiroshi Sugimoto and Toshio Kawamura. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their respective fields.

Conclusion

Shigeharu Takahagi's contributions to wiring board technology exemplify the spirit of innovation. His patents and collaborations reflect a commitment to enhancing electronic connectivity and performance.

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