Wuhan, China

Shida Du

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shida Du. Retrieved from https://idiyas.com/inventor/shida-du

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:

goldMedal1 out of 834,513 
Other
 patents

Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Shida Du - Innovator in LED Packaging Technology

Introduction

Shida Du is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of LED packaging technology. His innovative work focuses on enhancing the reliability and efficiency of LED packaging through advanced materials.

Latest Patents

Shida Du holds a patent for a "Fluororesin interfacial agent for LED packaging, and methods for preparing and using same." This patent discloses a fluororesin interfacial agent that comprises a graphene oxide fluororesin sealant and a KH550 silane coupling agent solution. The unique combination of these materials allows for a chemical reaction that forms molecular crosslinking, which significantly improves the bonding capability of the fluororesin sealant. This innovation ensures the reliability of LED packaging, making it a valuable advancement in the industry. He has 1 patent to his name.

Career Highlights

Throughout his career, Shida Du has focused on developing materials that enhance the performance of LED technologies. His work has been recognized for its potential to revolutionize the packaging processes used in the LED industry.

Collaborations

Shida Du has collaborated with notable colleagues, including Renli Liang and Linlin Xu, who have contributed to his research and development efforts.

Conclusion

Shida Du's innovative approach to LED packaging technology exemplifies the impact of advanced materials in enhancing product reliability. His contributions are paving the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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