Hsinchu, Taiwan

Shiang-Jiann Liu

This inventor holds 1 USPTO granted patent. Top assignee: Promise Technology, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shiang-Jiann Liu. Retrieved from https://idiyas.com/inventor/shiang-jiann-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Shiang-Jiann Liu and Swappable Device Innovation.

Introduction

Shiang-Jiann Liu is an inventor associated with Hsinchu, Taiwan, and Promise Technology, Inc. His patent work includes a design for a swappable device that supports the movement and connection of a functional module interface card.

Latest Patents

Liu is named on 1 patent: “Swappable Device and Data Processing System Including Such Swappable Device.” The invention describes a device with first and second side covers, a lever, a sliding plate, and a functional module interface card. Rotating the lever guides the sliding plate through coordinated grooves, moving the card toward the lower edge of the first side cover until its connectors reach their farthest position relative to the cover’s upper edge. This mechanism provides a controlled way to position the module and its connectors.

Career Highlights

Liu’s listed patent reflects work on mechanical arrangements for swappable devices and data-processing systems. The patent identifies Promise Technology, Inc. as his company.

Collaborations

The supplied information lists Pin-Hsin Kao and Chung-Shin Liu as Liu’s coworkers. Their names are provided as professional associations, without further details about their roles in the patent.

Conclusion

Shiang-Jiann Liu’s patent documents a guided mechanism for positioning a functional module interface card in a swappable device, highlighting his contribution to data-processing hardware design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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