Chengdu, China

Shi Kong Lin

This inventor holds 11 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Siemens Aktiengesellschaft. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shi Kong Lin. Retrieved from https://idiyas.com/inventor/shi-kong-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 72.7


Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 74(Granted Patents)


Company Filing History:


Years Active: 2023-2026

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11 patents (USPTO):Explore Patents

Title: The Innovative Journey of Shi Kong Lin

Introduction

Shi Kong Lin is a prominent inventor based in Chengdu, China. He has made significant contributions to the field of technology, holding a total of 11 patents. His work primarily focuses on advancements in computer technology, showcasing his expertise and innovative spirit.

Latest Patents

Among his latest patents, Shi Kong Lin has developed several groundbreaking computer technologies. These innovations reflect his commitment to enhancing the efficiency and functionality of computing systems.

Career Highlights

Shi Kong Lin is currently employed at Siemens Aktiengesellschaft, a leading global technology company. His role at Siemens allows him to collaborate with other talented professionals and contribute to cutting-edge projects in the tech industry.

Collaborations

Throughout his career, Shi has worked alongside notable colleagues, including Xue Kang Li and Ting Lai. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions.

Conclusion

Shi Kong Lin's contributions to technology through his patents and collaborations highlight his role as a key figure in the field of computer innovation. His work continues to inspire future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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