Kaohsiung, Taiwan

Shengfu Hsiao

This inventor holds 1 USPTO granted patent. Top assignee: Silergy Semiconductor Technology (Hangzhou) Ltd. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shengfu Hsiao. Retrieved from https://idiyas.com/inventor/shengfu-hsiao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Shengfu Hsiao: Inventor of a Multi-Phase Voltage Converter.

Introduction

Shengfu Hsiao is an inventor based in Kaohsiung, Taiwan. His work includes a patented design for a multi-phase voltage converter, and he is associated with Silergy Semiconductor Technology (Hangzhou) Ltd.

Latest Patents

Hsiao’s listed patent, “Multi-phase voltage converter,” describes a power conversion system organized into multiple levels. A control chip generates N pulse distribution signals, where N is an integer greater than one. The power conversion module contains N first-level conversion modules, which can include second-level modules and, in turn, third-level modules. When a second-level module contains multiple third-level modules, those modules are connected in parallel. The design distributes phase signals through the levels to coordinate the conversion modules. Hsiao is credited with 1 patent.

Career Highlights

Hsiao’s listed invention concerns the architecture and control of a multi-phase voltage conversion system. The patent describes how pulse and phase distribution signals can coordinate conversion modules arranged across several levels.

Collaborations

Hsiao’s listed coworkers include Chiachi Liu and Liwen Liu. His company affiliation is Silergy Semiconductor Technology (Hangzhou) Ltd.

Conclusion

Shengfu Hsiao’s patent presents a hierarchical, signal-coordinated approach to multi-phase voltage conversion, reflecting his documented contribution to power-conversion technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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