Sheng-Wen Huang

Title: Innovations of Sheng-Wen Huang

Introduction

Sheng-Wen Huang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronics, particularly in the area of semiconductor devices. With a total of 3 patents to his name, Huang's work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is titled "Stud bump for wirebonding high voltage isolation barrier connection." This electronic device features a bond wire with a first end bonded by a ball bond to a planar side of a first conductive plate, and a second end bonded by a stitch bond to a conductive stud bump at an angle greater than or equal to 60 degrees. The wirebonding method includes bonding the first end of the conductive bond wire to the first conductive plate by forming a ball bond and bonding the second end to the conductive stud bump through a stitch bond.

Another significant patent is "Semiconductor device packages with high angle wire bonding and non-gold bond wires." This apparatus includes a package substrate with a die mount portion and lead portions spaced from the die mount portion. It features a semiconductor die over the die mount portion, with non-gold bond wires forming electrical connections between the bond pads and the lead portions of the package substrate. The design incorporates a bond stitch on bump connection formed between one of the non-gold bond wires and a bond pad of the semiconductor die.

Career Highlights

Huang has worked with prominent companies such as Texas Instruments Corporation and Capella Microsystems (Taiwan), Inc. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Throughout his career, Huang has collaborated with talented individuals, including Chien-Chang Li and Hung-Yu Chou. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Sheng-Wen Huang's contributions to the field of electronics and semiconductor devices are noteworthy. His innovative patents and collaborations with industry leaders highlight his role as a significant inventor in the technology sector.