Kaohsiung, Taiwan

Sheng-Wei Wang

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignees: King Slide Technology Co., Ltd., King Slide Works Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng-Wei Wang. Retrieved from https://idiyas.com/inventor/sheng-wei-wang-l8nmy77n

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Sheng-Wei Wang: Inventor of a Slide Rail Assembly

Introduction

Sheng-Wei Wang is an inventor associated with Kaohsiung, Taiwan. His work includes a patented slide rail assembly designed to help retain and release a movable aiding-slide device as a rail is detached or reinserted. Wang is credited with 1 patent.

Latest Patents

Wang’s listed patent, “Slide Rail Assembly,” describes a first rail, a second rail, an aiding-slide device, and an auxiliary member. The aiding-slide device moves between the two rails, while the auxiliary member is arranged on the first rail.

When the second rail is detached from the first rail’s channel, features on the aiding-slide device and the auxiliary member’s resilient arm engage to hold the device in a predetermined position. When the second rail is inserted, a working portion presses against the resilient arm, disengaging those features and allowing the assembly to move.

Career Highlights

Wang is associated with King Slide Works Co., Ltd. and King Slide Technology Co., Ltd. His patent focuses on the interaction of rail components and a resilient retaining mechanism.

Collaborations

Wang’s listed coworkers include Ken-ching Chen and Shun-Ho Yang.

Conclusion

Sheng-Wei Wang’s patented slide rail assembly addresses the controlled retention and release of a movable component, reflecting his work in mechanical rail design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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