Taoyuan, Taiwan

Sheng-Kun Huang

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Htc Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng-Kun Huang. Retrieved from https://idiyas.com/inventor/sheng-kun-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Sheng-Kun Huang: Innovator in Flexible Polymer Technology.

Introduction

Sheng-Kun Huang is an inventor based in Tainan City, Taiwan. He has made significant contributions to the field of flexible polymer-based materials. His innovative approach focuses on enhancing the properties of these materials through advanced methods.

Latest Patent Applications

Sheng-Kun Huang has filed a patent application titled "Method for making high metallic luster, high impedance on flexible polymer based material." This invention relates to a method for creating a lustrous layer on the surface of flexible polymer-based materials. The process involves wet coating to apply a lustrous layer on the first surface, followed by a color protection layer on either the lustrous layer or the second surface. This technique enhances the metallic feel and luster of the material, resulting in a low metal shielding effect. Additionally, it improves the transmittance of light and electromagnetic waves, thereby avoiding interference in transmission and receiving quality.

Conclusion

Sheng-Kun Huang's work in flexible polymer technology showcases his innovative spirit and dedication to improving material properties. His patent application reflects a promising advancement in the field, highlighting the potential for enhanced applications in various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…