Sheng-Feng Chung

Title: Innovations of Sheng-Feng Chung

Introduction

Sheng-Feng Chung is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 8 patents. His work focuses on enhancing the efficiency and functionality of multi-die packages and chip modules.

Latest Patents

One of his latest patents is a multi-die package that includes a main die and a memory die, along with two sets of pins. This innovative design allows the memory controller to access both the memory die and an external memory chip efficiently. Another significant patent involves a chip package module that features flip-chip ground pads and power pads, as well as wire-bonding ground pads. This module is designed to improve the electrical connection between the chip and the package substrate, enhancing overall performance.

Career Highlights

Sheng-Feng Chung has worked with prominent organizations such as the Industrial Technology Research Institute and Realtek Semiconductor Inc. His experience in these companies has allowed him to develop cutting-edge technologies that have advanced the semiconductor industry.

Collaborations

Throughout his career, Chung has collaborated with talented individuals, including Su-Tsai Lu and Shu-Yi Chang. These partnerships have contributed to the successful development of his innovative projects.

Conclusion

Sheng-Feng Chung's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in multi-die packaging and chip modules.