Industrial Technology Research Institute

Realtek Semiconductor Inc.

Sheng-Feng Chung

Su-Tsai Lu

Shu-Yi Chang

Cheng-Yi Shih

Chun-Ting Liu

Chen-Kun Chen

Kuo-Hua Tseng

Bao-Shun Yau

Heng-Tien Lin

Wen-Yung Yeh

Yi-Ming Chang

Shih-Ming Lin

Yu-Ling Hsieh

Yu-Jie Wei

Cheng-Lun Chu

The present invention provides a multi-die package including main die, a memory die, a first set of pins and a second set of pins. The main die includes a memory controller, a first set of pads, a second set of pads and a third set of pads. The memory die is coupled to the first set of pads and the second set of pads of the main die. The first set of pins is coupled to the third set of pads of the main die. The second set of pins is coupled to the second set of pads of the main die. The memory controller accesses the memory die through the first set of pads and the second set of pads, and the memory controller accesses a memory chip external to the multi-die package through the second set of pads and the third set of pads.

Multi-die package

A chip package module is provided. The chip package module includes a package substrate, a chip, and a conductive connector assembly. The chip having a first surface and a second surface opposite thereto is disposed on the package substrate. The first surface is divided into a first region, a second region, and a third region, and the second region is located between the first and third regions. The chip includes a flip-chip pad group disposed in the first region, a wire-bonding pad group disposed in the third region, and a signal pad group disposed in the second region. The conductive connector assembly is electrically connected between the chip and the package substrate. One of the flip-chip pad group and the wire-bonding pad group is electrically and physically connected to the conductive connector assembly, and the other one is not physically connected to the conductive connector assembly.

Chip package module including flip-chip ground pads and power pads, and wire-bonding ground pads and power pads

A mesh electrode, a sensing device and an electrode layer are provided, in which the sensing device includes the mesh electrode. The mesh electrode is formed by a plurality of grid lines intersecting and connected to each other. The grid line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion. The electrode layer includes a plurality of conducting lines. The conducting lines have at least three line widths or at least three spaces. An appearing probability of each line width may be identical in the electrode layer. An appearing probability of each space may be identical in the electrode layer. The conducting line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion.

Mesh electrode, sensing device, and electrode layer

In one embodiment, a conductive line structure includes a substrate and a plurality of conductive lines thereon. The substrate has a first area and a second area, and the two areas are separated by at least one borderline. The plurality of conductive lines are disposed at the first area and the second area of the substrate, respectively. The at least one borderline may be a straight line, and the conductive lines disposed at the second area are inclined relative to the at least one borderline. A sensing device using the conductive line structure is also provided.

Conductive line structure and sensing device using the same

A sensing structure includes a sensing unit, a periphery circuit, and a connecting circuit. The connecting circuit connecting the sensing unit and the periphery circuit includes a connecting pattern. In an embodiment, the connecting pattern has at least two line widths. The line width of a part of the connecting pattern connecting the periphery circuit is greater than the line width of a part of the connecting pattern connecting the sensing unit. In an embodiment, the connecting pattern includes a mesh pattern having at least two mesh densities. The mesh density of a part of the mesh pattern connecting the periphery circuit is greater than the mesh density of a part of the mesh pattern connecting the sensing unit. In an embodiment, the connecting circuit includes lines between and connecting a single sensing series of the sensing unit and a periphery wire of the periphery circuit.

Sensing structure

A gravure printing system is provided. The gravure printing system includes a plate cylinder, an ink source, a cover blade, and a doctor blade. The plate cylinder has a circumferential surface with at least one groove. The ink source is adapted to provider an ink onto the circumferential surface of the plate cylinder. The cover blade is adapted to form an anti-drying layer on the plate cylinder from the ink. The doctor blade is adapted to contact the plate cylinder and fill the at least one groove with the ink. A point on the circumferential surface sequentially passes by the ink source, the cover blade, and the doctor blade as the plate cylinder rotates. A Young's modulus of a material of the cover blade is less than a Young's modulus of a material of the doctor blade. A method of using the gravure printing system is also provided.

Gravure printing system and method of using the same

A touch panel structure includes a transparent substrate having a touch area and a frame wire area, X conductive electrodes, Y conductive electrodes, X conductive connecting sections connecting the X conductive electrodes along a first direction, frame wires, insulated layers and Y conductive connecting bridges on the insulated layers. The X and Y conductive electrodes are respectively arranged in an array in the touch area and interlaced with each other. The X and Y conductive electrodes are electrically connected to an external circuit via the frame wires. The insulated layers each cover one of the X conductive electrodes and two of the Y conductive electrodes. The Y conductive electrodes are electrically connected to each other via the Y conductive connecting bridges along a second direction. A conducting material is performed by one-time printing to pattern the X and Y conductive electrodes, X conductive connecting sections and frame wires.

Touch panel structure and fabrication method for the same

An illumination device includes an OLED panel, an electrode structure, and a control module. The OLED panel includes a light-emitting layer configured to emit a light beam. The electrode structure is overlaid on the OLED panel. The electrode structure includes a first touch electrode including at least two conductive portions, and the conductive portions of the first touch electrode are electrically connected to the other conductive portions. The control module is electrically connected to the OLED panel and the first touch electrode. The light-emitting layer further includes a light-emitting material, and a width of the light-emitting material is greater than half of a width of the first touch electrode.

Growing community of inventors

Hsinchu, Taiwan

Sheng-Feng Chung