Sheila Konecke-Lease

Title: Innovations by Sheila Konecke-Lease

Introduction

Sheila Konecke-Lease is a notable inventor based in Leesburg, VA (US). She has made significant contributions to the field of solder joint fabrication. Her innovative approach has led to the development of a unique method that enhances the efficiency of aligning and mounting solder balls to a substrate.

Latest Patents

Sheila holds a patent for a method of aligning and mounting solder balls to a substrate. This process involves fabricating a plurality of solder joints using low melting point solder paste and high melting point solder balls. The process flow begins with placing solder balls into cavities in an alignment boat, followed by applying solder paste directly onto the solder balls. An alignment plate is then used to align the solder ball/solder paste combination to the substrate. The substrate is placed on top of the solder balls, and pressure is applied to wet the solder paste to the conductive pads. Finally, the assembly is processed through a furnace for solder paste reflow. This method eliminates the need for expensive alignment tools, as the substrate can realign itself during reflow due to the surface tension of the molten solder paste.

Career Highlights

Sheila Konecke-Lease is currently employed at International Business Machines Corporation (IBM). Her work at IBM has allowed her to explore and develop innovative solutions in the field of electronics manufacturing. She has demonstrated a strong commitment to advancing technology through her inventive contributions.

Collaborations

Sheila has collaborated with notable colleagues, including Richard W. Cummings and George Charles Correia. These collaborations have further enriched her work and contributed to the success of her projects.

Conclusion

Sheila Konecke-Lease is a pioneering inventor whose work in solder joint fabrication has made a significant impact in the field. Her innovative methods continue to influence the electronics manufacturing industry.