Hertfordshire, United Kingdom

Shaun Ruck

This inventor holds 1 USPTO granted patent. Top assignee: Nokia Corporation. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shaun Ruck. Retrieved from https://idiyas.com/inventor/shaun-ruck

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Shaun Ruck: Innovator in In-Mould Labelling Technology

Introduction

Shaun Ruck is a notable inventor based in Hertfordshire, GB. He has made significant contributions to the field of manufacturing through his innovative patent in in-mould labelling technology. His work has implications for various industries, particularly in enhancing product packaging efficiency.

Latest Patents

Shaun Ruck holds a patent for an In-Mould Labelling process. This process involves clamping a label within a mould void of an injection moulding tool and injecting material into the mould void while the label is clamped. Additionally, it includes placing a label between a first mould void and a second, separate mould void, followed by injecting material into both mould voids. This innovative approach streamlines the labelling process and improves production efficiency.

Career Highlights

Shaun Ruck is currently employed at Nokia Corporation, where he applies his expertise in engineering and innovation. His role at Nokia allows him to work on cutting-edge technologies that align with his passion for improving manufacturing processes.

Collaborations

Shaun collaborates with Simon Wilson, a fellow innovator, to explore new ideas and enhance their projects. Their partnership exemplifies the importance of teamwork in driving innovation forward.

Conclusion

Shaun Ruck's contributions to in-mould labelling technology demonstrate his commitment to innovation and efficiency in manufacturing. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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